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INTEGRATED CIRCUITS
DATA SHEET
SAA1310 Control interface for VHS video recorders
Product specification File under Integrated Circuits, IC02 April 1995
Philips Semiconductors
Product specification
Control interface for VHS video recorders
FEATURES * Full support of VISS and VASS mode (VHS Index/Address Search System) * Read, write and overwrite of Tape Control/head signal (CTL) * Power-ON and power-failure indicator * 4 general purpose comparators for interface between sensors and microprocessor * 2 comparators have a 100 mA output driver * PAL and NTSC compatible ORDERING INFORMATION EXTENDED TYPE NUMBER SAA1310 SAA1310T Note 1. SOT102-1; 1996 December 02. 2. SOT163-1; 1996 December 02. 18 20 PACKAGE PINS DIL SO PIN POSITION MATERIAL plastic plastic GENERAL DESCRIPTION
SAA1310
The SAA1310 provides an interface between the tape control head in the VHS deck-electronics. The circuit also includes an interface between sensors in the deck mechanics and the microprocessor.
CODE SOT102 (1) SOT163A (2)
April 1995
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
handbook, full pagewidth
write current
WRITE AMPLIFIER
10 (11)
write/read input
16 (18) capstan reverse input 18 (20)
control head data output
control head input/output control head feedback reference voltage output
2 (2) 1 (1) 3 (3) VP
AMPLIFIER FILTER DETECTOR
SAA1310 (SAA1310T)
Vref
POWER-ON AND POWER-FAILURE DETECTOR V ref 5 (6) comparator 1
17 (19)
power on/failure output
4 (4) 15 (17)
power on/failure capacitor comparator 1 output
comparator 1 non - inverting input
comparator 2 non - inverting input
6 (7)
comparator 2 14 (15) comparator 2 output
comparator 3 inverting input
7 (8)
comparator 3
13 (14)
comparator 3 output
comparator 4 inverting input
8 (9)
comparator 4
11 (12)
comparator 4 output
9 (10)
12 (13)
MEA082 - 1
VP
GND
Pin numbers in parenthesis refer to the SAA1310T.
Fig.1 Block diagram.
April 1995
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
PIN CONFIGURATION
SAA1310
handbook, halfpage dbook, halfpage
CTL FB 1 CTL FB 1 CTL I/O 2 Vref 3 18 CAPREV CTL I/O 2 17 PO/FAIL OUT 16 CTL DATA 15 COUT1 Vref 3 CPO/FAIL 4
20 CAPREV 19 PO/FAIL OUT 18 CTL DATA 17 COUT1 16 n.c.
CPO/FAIL 4 CIN1 5 CIN2 6 CIN3 7 CIN4 8 VP 9
MEA083
SAA1310
n.c. 5 14 COUT2 CIN1 6 13 COUT3 CIN2 7 12 GND CIN3 8 11 COUT4 CIN4 9 10 WRITE/READ VP 10
MEA084
SAA1310T
15 COUT2 14 COUT3 13 GND 12 COUT4 11 WRITE/READ
a. SAA1310. Fig.2 Pin configurations.
b. SAA1310T.
PINNING (pins in parenthesis refer to SAA1310T) SYMBOL CTL FB CTL I/O Vref CPO/FAIL CIN1 CIN2 CIN3 CIN4 VP WRITE/READ COUT4 GND COUT3 COUT2 COUT1 CTL DATA PO/FAIL OUT CAPREV 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 PIN (1) (2) (3) (4) (6) (7) (8) (9) (10) (11) (12) (13) (14) (15) (17) (18) (19) (20) control head feedback control head input/output reference voltage output power on/failure capacitor comparator 1 input comparator 2 input comparator 3 input comparator 4 input supply voltage write/read input comparator 4 output ground comparator 3 output comparator 2 output comparator 1 input control head data output power on/failure output capstan reverse input DESCRIPTION
April 1995
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
LIMITING VALUES (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T) In accordance with the Absolute Maximum System (IEC 134) SYMBOL VP VI/VO VO Tstg Tamb PARAMETER supply voltage range voltage on all pins output voltage on pins 11 (12) and 13 (14) storage temperature range ambient temperature range except pins 11 (12) and 13 (14) CONDITIONS MIN. 0 0 0 -65 0
SAA1310
MAX. 6.0 VP 18 +150 +70
UNIT V V V C C
THERMAL RESISTANCE SYMBOL Rth Rth PARAMETER thermal resistance (SAA1310) thermal resistance (SAA1310T) 75 90 TYP. - - MAX. K/W K/W UNIT
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
CHARACTERISTICS (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T) VP = 5 V; Tamb = 25 C; all voltage referenced to pin 12 (13); according to the test set-up (see Fig.4); unless otherwise specified SYMBOL Pd VP IP PARAMETER power dissipation note 1 CONDITION - MIN. TYP. 85 - MAX. UNIT mW
Supply pin 9 (10) supply voltage supply current read mode write mode; duty factor = 50% CTL I/O pin 2 (2) READ MODE PIN 10 (11) < 0.5 V VI B Ib VO VO input voltage (peak-topeak value) bandwidth low-pass filter input bias current output voltage LOW output voltage HIGH read mode ICTL I/O = 3 mA; pin CTL DATA = HIGH ICTL I/O = - 3 mA; pin CTL DATA = LOW WRITE/READ pin 10 (11) VI II input voltage input current read mode write mode; analog read mode write mode Vref pin 3 (3); note 2 VO Itot RO VIH VIL IIH IIH output voltage total current output resistance including write current 2.4 -4 - 2.5 - 0.4 - - - - 2.6 +4 0.6 - 0.8 10 - V mA - 1.6 - - - - 0.1 0.5 3.3 - V V A A 4.6 - - V f = 500 Hz 0.35 - - - - - 3 0.1 - - 200 - - 0.4 mV mV kHz A V f = 30 kHz; non-linear operation - 4.5 10 13 5.0 15 18 5.5 20 24 V mA mA
WRITE MODE PIN 10 (11) > 3.5 V
- 1.5 -
CAPREV pin 18 (20) input voltage HIGH input voltage LOW input current HIGH input current LOW VCAPREV = 5 V VCAPREV = 0 V 2.0 - - -10 V V A A
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
SYMBOL
PARAMETER
CONDITION
MIN.
TYP.
MAX.
UNIT
CTL DATA pin 16 (18) WRITE MODE VIH VIL IIH IIL VOL VOH VO VOL VOH td VTL1 VTL2 IO IO VO(min.) VO(max.) input voltage HIGH input voltage LOW input current HIGH input current LOW output voltage LOW output voltage HIGH VCTL DATA = 5 V VCTL DATA = 0 V IOL = 0.5 mA IOH = - 50 A at decreasing VP IOL = 1 mA IOH = 1 mA CCAPREV = 68 nF 2.0 - - -10 - 2.4 - - - - - - - - - 50 - 3.5 -3 300 20 2.1 - 0.8 10 - 0.4 - V V A A V V
READ MODE
CPO/FAIL and PO/FAIL OUT pin 4 (4) and 17 (19); see Fig.3 operating voltage range output voltage LOW output voltage HIGH delay time threshold level 1 threshold level 2 source current pin 4 sink current pin 4 minimum output voltage maximum output voltage 1.5 - VP - 0.9 - 4.5 - - - - - 5.5 0.4 - - 4.8 - - - - - V V V ms V V A A mV V
High output current type comparators CIN3 and CIN4 pins 7 (8) and 8 (9) Vhys VIL VIH IIL IIH VOL IOL ttr Tj input hysteresis input voltage LOW input voltage HIGH input current LOW input current HIGH output voltage LOW leakage current transient time thermal protection CIN3 = CIN4 = 0 V CIN3 = CIN4 = VP IOL = 100 mA IOL = 2 mA output voltage HIGH; COUT3 = COUT4 = 17 V note 3 - - Vref + 10 mV -1 - - - - - - 10 - - - - - - - 0.5 130 - Vref - 10 mV - - +1 1.0 0.4 1 - - mV V V A A V V A s C
COUT3 and COUT4 pins 13 (14) and 11 (12)
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
SYMBOL
PARAMETER
CONDITION
MIN.
TYP.
MAX.
UNIT
Low output current type comparators CIN1 AND CIN2 pins 5 (6) and 6 (7) Vhys VIL VIH II input hysteresis input voltage LOW input voltage HIGH input current CIN1 = CIN2 = 0 V CIN1 = CIN2 = VP COUT1 AND COUT2 pins 15 (17) and 14 (15) VOL VOH ttr output voltage HIGH output voltage LOW transient time IOH = -100 A IOL = 2 mA note 4 4.5 - - - - 0.5 - 1 - V V s - - Vref + 10 mV -1 - 10 - - - - - Vref - 10 mV - - +1 mV V V A A
Notes to the characteristics 1. Without the sink current of the comparators; in write mode. 2. Minimum value of capacitor connected to this pin is 4.7 F. 3. Vi = 100 mV p-p. Inputs connected to Vref via a 10 k resistor; outputs connected to VP via a 250 resistor. 4. Vi = 100 mV p-p. Inputs connected to Vref via a 10 k resistor; outputs connected to VP via a 2.5 k resistor.
April 1995
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
VP td 100 VTL1 VTL2 1.5 V t
V17 (19) td td td 100 td
t
MEA085
Fig.3 Power-ON and power-failure detector.
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April 1995
write current WRITE AMPLIFIER R 16 (18) I W 18 I (20) I 10 (11) 2 (2) 1 (1) - VP Vref V POWER-ON AND POWER-FAILURE DETECTOR 17 (19) V ref 4 (4) 5 (6) + comparator 1 15 (17) I V 14 (15) 13 (14) comparator 3 V V I - V I + AMPLIFIER FILTER DETECTOR 3 (3)
handbook, full pagewidth
Philips Semiconductors
I
APPLICATION INFORAMTION
I
10 F
Vi
82 nF
650
Control interface for VHS video recorders
10
SAA1310 (SAA1310T)
6 (7) + comparator 2 - I V 7 (8) + - 8 (9) + comparator 4 - 9(10) 12(13)
MEA086 - 1
I
V
I
I
V
11 (12) V
I
I
V
GND VP
Pin numbers in parenthesis refer to the SAA1310T.
Product specification
SAA1310
Fig.4 Test circuit diagram.
Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
handbook, full pagewidth
1 (1) 47 F 2 (2) CTL head 4.7 nF 3 (3) VI 47 F 68 nF VI 4 (4)
18 (20) 17 (19)
CAPREV
PO/FAIL OUT
16 (18) 15 (17)
CTL DATA
COUT1
5 (6)
14 (15)
COUT2
SAA1310 (SAA1310T)
VI VI 6 (7) 13 (14) COUT3
VI
7 (8)
12 (13)
8 (9)
11 (12)
COUT4
+5 V 47 F
9 (10)
10 (11)
47 k 100 nF
WRITE/READ
MEA087
Pin numbers in parenthesis refer to the SAA1310T.
Fig.5 Application diagram.
April 1995
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
PACKAGE OUTLINES DIP18: plastic dual in-line package; 18 leads (300 mil)
SAA1310
SOT102-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 18 10 b2 MH wM (e 1)
pin 1 index E
1
9
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.044 b1 0.53 0.38 0.021 0.015 b2 1.40 1.14 0.055 0.044 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-10-14 95-01-23
April 1995
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
SAA1310
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
April 1995
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
SAA1310
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
Control interface for VHS video recorders
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
SAA1310
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
April 1995
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